Contactless Mobility

Description

The LEI 1600 Mobility Measurement System has the capability of measuring various semiconductor transport properties, which include mobility, sheet charge density and sheet resistance via a non-contact measurement method.

This tool utilizes a 10GHz microwave source to interrogate wafers coated with conductive thin films. The forward and reflected RF power values as a function of external magnetic field (0-10kG) are used in an extremely complicated model to attempt calculation of carrier concentration, mobility, and sheet resistance.

Capabilities

• Wafer Diameter: 2” – 150 mm
• Wafer Thickness: 15 – 25 mils
• Measurement Diameter: 21mm
• Mobility: 600-20,000 cm2/v-sec
• Sheet Resistance: 100-3,000 ohms/sq.
• Non-destructive
• Provides instant feedback
• Mapping capability
• Repeatability

Related Equipment

• Bio-Rad (Hall, polaron)
• PPMS