SuSS MJB4 Contact Aligner

Description

Our SuSS MJB4 Mask aligner utilizes a 350W Hg bulb with an i-line (365nm) filter to expose substrates up to 100mm diameter coated in photoresist.  The sample stage and single field microscope head translate in x, y, and theta independently of a fixed mask stage (maximum 5”x5” mask plate) to allow for wafer-to-mask alignment and pattern transfer down to an ultimate resolution of 0.7 micrometers.  This equipment can also be configured to utilize an IR microscope mode to align features on the backside of the substrate to mask features intended to pattern the topside of the substrate.

Capabilities

• Allows samples up to 100mm in diameter.
• Backside alignment
• Multiple exposure modes in order of lowest to highest resolution:
  • gap
  • soft contact
  • hard contact
  • low vacuum
  • high vacuum