Wafer Bonder

Description

Our EVG 501 wafer bonder system applies pressure up to 10kN and temperature up to 450C to samples with prepared surfaces (specific chemical surface termination).  When the system mechanically brings these surfaces into contact the temperature and pressure sequence activates chemical bonds at the interfaces that fuse the sample surfaces together.

Capabilities

• Pressures up to 10kN
• Temperature up to 450C
• Max sample size 100mm
• Manual alignment only